| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2005-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bee26c4188e3c15cf4662ad177d3d674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8c275b28e7db7fd8583c0f4738d0bed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16e9706a82a2e91b1bcb4b506cf41311 |
| publicationDate |
2006-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102005024912-A1 |
| titleOfInvention |
A technique of making copper-containing leads embedded in a low-k dielectric by providing a stiffening layer |
| abstract |
BynProviding a stiffening layer on three side walls of anwith a copper-containing metal to be filled trench, the reducednthermomechanical confinement strength of a material with small ε at leastncompensated to a certain extentnto reduce electromigration effects, and thenLifetime of modern semiconductor devices that increasenHave metallization layers, in which dielectric materialsnwith small ε innConnection with copper-based metal cables are included. |
| priorityDate |
2005-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |