http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102005004366-A1

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filingDate 2005-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102005004366-A1
titleOfInvention Method for producing conductive structures in an integrated circuit arrangement and circuit arrangement
abstract It is explainedna method in which an electrically conductive growth nucleation layernis applied. The method is especially for manufacturingna lower metallization used, wherein an electricalninsulating insulating layer only after the application of the nucleation layernis applied and structured so that selectively to be plated areasnof the nucleation layer are exposed. At the nucleation layer becomesnthen electrically conductivenMaterial (29) deposited. Subsequently, the nucleation layernremoved again. The result is a lead structure (28) with columnarngrainsnand a very small minimum lateral dimension, e.g. B. smallernas 500 nanometers.
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Total number of triples: 31.