http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102005002967-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B26-0833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00611 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2005-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_308ffb1cec86b5cb6ff58f321df0c4d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec0cde9274e10ea4c7ec019c27f00c15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d587174d1bbf7a73418f0dad880552bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_595bed50bc8ca9b508c25b4a2776a294 |
| publicationDate | 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102005002967-B4 |
| titleOfInvention | Method for producing a component with a movable section |
| abstract | A method of making a device (30) having a moveable portion spaced from a support wafer (10), comprising the steps of: Providing the carrier wafer (10) having a textured surface; Providing a device wafer (18, 20, 22), the device wafer having a support layer (18, 20) and a device layer (22) disposed thereon; Forming a first planarization layer (12, 14) of a first stock material on the support wafer (10) with a first method to fill the structures of the structured surface of the support wafer, thereby obtaining a planarized surface having a first degree of planarization, the first method polishing the first starting material after application of the first starting material to obtain a polished surface, the polished surface being the planarized surface having the first degree of planarization; Forming a second planarization layer (16) of a second source material on the planarized surface of the support wafer (10) with a second method to form a surface with a second surface. |
| priorityDate | 2005-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.