| abstract |
The invention relates to a component arrangement comprising a semiconductor chip (10), a chip carrier (21), a contact piece (22) and a housing (30). The semiconductor chip (10) comprises a first load terminal (11), a second load terminal (12) and a control terminal (13), wherein the first load terminal (11) and the second load terminal (12) are arranged on opposite sides of the semiconductor chip (10) are. The semiconductor chip (10) is arranged on the chip carrier (21) and electrically and thermally conductively connected to the first load terminal (11). The contact piece (22) is arranged on the second load terminal (12) and electrically and thermally conductively connected thereto. The housing (30) is formed of a dielectric material surrounding the semiconductor chip (10), the chip carrier (21) and the contact piece (22). The chip carrier (21) is exposed on a first side (31) of the housing (30), the contact piece (22) on one of the first side (32) opposite the second side (32) of the housing (30). From the housing (30) a connecting leg (23) is led out, which is electrically conductively connected to the control terminal (13). The invention further relates to a component cascade in which a plurality of component arrangements are stacked on top of each other. |