http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004056492-B3

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filingDate 2004-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85ec746b6bc7a1646ca318d4bd8f10ba
publicationDate 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102004056492-B3
titleOfInvention Process for the structured application of a thermoplastic paste to a substrate and its use
abstract The present invention relates to a method for the structured application of a thermoplastic paste (4), in particular a metal-containing thermoplastic paste (4), to a substrate (5). It consists of the following steps: - introducing paste (4) into structured depressions (2) of a printing form (1), - Transferring the paste (4) according to the structure of the wells (2) on a transfer medium (3) and - Transferring the paste (4) from the transfer medium (3) on a substrate (5). It is characterized in that the printing plate (1) has a first temperature T 1 , wherein the paste (4) is liquid, so that it completely into the recesses (2) of the printing plate (1) flows in and in the transfer the transfer medium (3) from the wells (2) as completely dissolved out that the transfer medium (3) has a second temperature T 2 , wherein the paste (4) has a dimensionally stable state, and that the substrate (5) has a third temperature T 3 , in which a complete transfer of the paste (4) from the transfer medium (3) to the substrate (5) is ensured and in which the paste (4) remains dimensionally stable.
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