| abstract |
ThenInvention relates to a layer (1) between interfaces (2)ndifferent components (5, 6) in semiconductor devices (10)nand a process for their preparation. This is indicated by a componentn(5) as an interfacen(2) surfacesn(3) a circuit carrier (11)nand another component (6) has as an interface (2)nContact surfaces (4)na plastic housing compoundn(9). The adhesion-improving layer (1) is a mixturenfrom polymeric chain moleculesnand carbon nanotubes. |