| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_54da2c55acc520080b9f194c7a839f23 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4061 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
| filingDate |
2004-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16187e381615225a6adf198eab3bf9aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_492765c2d3dcf5cac9ccc1c8df2522e8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2619aa7759bb0ed94d832210aa52a5af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a58c617b7468fa5217e73ce99e0659a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51ca07ef0ac85ab66b366dde6691fa09 |
| publicationDate |
2006-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102004032706-A1 |
| titleOfInvention |
Method for producing an electrical component and the component |
| abstract |
Itnis a method for producing an electrical componentn(1) proposed, in which in a method step A) a ceramic base body (5)nis provided, the a via (10) and at leastna metalization surface (20C) electrically conductively connected to the via. Onnthe surfacenof the basic bodynwill at least overnthe via a first, electrically insulating materialnin process step B) in a layered formnarranged and then overnthe via (10) an electrically conductive second materialnapplied in process step C). In process step D) isnthen by curingna solder contactn(30B) formed by the passivation layer (25B) comprisingnthe first material is formed by sintering, through thenThrough connection (10) electrically conductively connects. |
| priorityDate |
2004-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |