| abstract |
Semiconductor device having a housing (8) at least a first semiconductor chip (1) and a chip carrier (2), wherein the semiconductor chip (1) has a first side, which faces the chip carrier (2) and on which a first connection contact (1a) and a second connection contact (1b) are arranged, the chip carrier (2) has a first chip carrier part (2a) and at least one second chip carrier part (2b) spaced therefrom and separated therefrom, a first contact layer (6a) is arranged between the first connection contact (1a) and the first chip carrier part (2a) and connects them to one another in an electrically conductive manner, a second contact layer (6b) is arranged between the second connection contact (1b) and the second chip carrier part (2b) and connects them to one another in an electrically conductive manner, the thicknesses (d1, d2) of the first (6a) and second (6b) contact layers are selected in a vertical direction such that a predetermined minimum distance to be maintained is not undershot between the semiconductor chip (1) and the chip carrier (2), and wherein at most one of the chip carrier parts (4c) is led out of the housing (8). |