| abstract |
Thin metallic adhesive layer on copper surfaces consisting of copper-tin alloys and other metals from Groups 4, 6, 8, 9, 10, 11, 12, and 13 of the Periodic Table being in the alloy From 1 to 50 at% of copper, 20 to 98 at% tin and 1 to 50 atomic% of at least one other metal selected from the group consisting of silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold and platinum, and the adhesive layer has a thickness of not less than 0.001 μm and not more than 1 μm. |