| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_54da2c55acc520080b9f194c7a839f23 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0919 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2004-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8434fa30aaa6699f843f665770602f75 |
| publicationDate |
2015-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102004010703-B4 |
| titleOfInvention |
Component with WLP-capable encapsulation and manufacturing process |
| abstract |
Electrical component With a substrate (SU) having terminal contacts (ANK) for electrical component structures (BS) on a main surface, - having a cover (AD), the pads (AF) and via electrical vias (D) with these connected external contacts (AUK), - In which on the main surface of the substrate (SU) an intermediate layer is arranged, in which cavities (KV) are formed, which are completely filled with conductive adhesive (LK) - In which the cover (AD) is seated on the intermediate layer so that the connection contacts are arranged corresponding to connection surfaces on the underside of the cover - Wherein an electrical connection between the terminal contacts and the pads exclusively via the filled with conductive adhesive (LK) cavities (KV) takes place. |
| priorityDate |
2004-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |