| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2001-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a50e407d178d7041923aaf945812c7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32f950a32e068047e4a6d8e3a78bf56e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0aa49f00d4e493301340b15670181533 |
| publicationDate |
2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10133571-B4 |
| titleOfInvention |
Electronic component and method for its production |
| abstract |
electronicnComponent with at least one semiconductor chip (2), with a carrier substraten(4) for mounting the at least one semiconductor chip (2) on a firstnsurfacen(14) of the carrier substraten(4), with contacting points which are electrically connected to the semiconductor chip (2)nare conductively connected and the one conductive connection in the carrier substraten(4) to external contactsnin the area of a second surfacen(16) of the carrier substraten(4), and with a housing (6), at least thensurrounds at least one semiconductor chip (2), wherein between housing (6)nand carrier substraten(4) a flexible decoupling layer (8) is provided so thatna mechanical decoupling of the housing (6) from the carrier substraten(4), and wherein the flexible decoupling layer (8) betweennSemiconductor chip (2) and carrier substraten(4) extends. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010029522-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8497583-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010029522-A1 |
| priorityDate |
2001-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |