| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-175 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2001-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e081ab555664d591070c9d9d6722a17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_944295cfe1466dc7a3c9724ef71cff3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb51ecc6250cd828e37570304f15e190
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74ce767632953a29117a592b955930c8 |
| publicationDate |
2002-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10126734-A1 |
| titleOfInvention |
Umverdrahtungsverfahren |
| abstract |
The invention relates to a method for rewiring electrical contact points (3), in particular on the surface (2) of an electronic or microelectronic component (1), with the following steps: applying and structuring at least one dielectric (4) on the component surface (2) ; Electroless deposition of a conductor starting layer (5) for the production of rewiring metal tracks (6) and replacement contact points (7) with short-circuit contacts (8) for connecting the individual rewiring metal tracks (6) and the corresponding electrical contact points (3); Strengthening the conductor start layer (5) by means of a common electroplating process and separating the short-circuit contacts (8) in order to separate the electrical contact points (3) or the contact points of the rewiring (7). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10334578-A1 |
| priorityDate |
2001-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |