| abstract |
The invention relates to a device and a method for packaging electronic components by means of injection molding technology, a large number of electronic components (2) being arranged on a first side (6) of a system carrier (4) and the system carrier having conductor tracks, contact connection surfaces for connecting to contact surfaces of the electronic components Components and vias for attaching external contact surfaces on a second side (8). The system carrier consists of a ceramic substrate, which is covered on the first side with a plastic layer. |