| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76852
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2001-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60e891c13026867c85a7ce3b0635924d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71ecaddcf2230dc1ff021116a3b5c540 |
| publicationDate |
2002-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10121495-A1 |
| titleOfInvention |
Circuit arrangement and method for producing an encapsulated circuit |
| abstract |
A conductor track arrangement (100) has a first layer (101) with a layer surface (102), on which there is a conductor track (104) with an exposed conductor track surface (105), the conductor track (104) having a first material, and with a second layer (107) arranged on the exposed conductor surface (105), the second layer (107) enclosing the conductor (104) on the exposed conductor surface (105) and comprising a second material which is mechanically harder than the first material. |
| priorityDate |
2001-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |