| abstract |
The invention relates to an electronic component (2) with a semiconductor chip (3) on which an interconnection structure (12) is arranged, which has a rewiring pattern (8) of conductor tracks buried under an elastomeric protective layer (11), which has contact areas (6) the active top side (4) of the semiconductor chip (3) connects to contact connections (9) which are arranged on elastomeric elements (10) embedded in the protective layer (11) in a form-fitting manner. The invention also relates to a method for producing such electronic components (2). |