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publicationDate 2002-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-10104731-A1
titleOfInvention Ion-binding polymer coating to reduce the toxicity of semiconductor substrates
abstract Solid semiconductor substrates give off through long-term contact with liquids (metal) ions by diffusion to the medium. To trap these often toxic compounds, there is on the one hand the possibility of adding specifically ion-binding molecules in solution, but this does not really prevent the release of the toxic components themselves. This can be achieved by using polymer coatings (thickness> 50 nm), which act as a physical diffusion barrier, but which do not offer any specificity with regard to a certain class of compound. With the concept proposed here of solid-state-coupled, specifically ion-binding polymer coatings (thickness <10 nm), both approaches are combined and thus more effectively prevent contamination of the solution. DOLLAR A In the proposed semiconductor coating, specific metal ion-binding molecules are covalently incorporated into a polymer matrix, which is anchored directly to the substrate surface via a coupling layer. An adsorbed monolayer of organic compounds (1-2 nm), which can bind to the semiconductor surface via specific chemical functionalities (e.g. thiol, amine, phosphine), serves as the coupling layer to the semiconductor substrate. It already acts as a diffusion-inhibiting barrier that prevents the release of toxic metal ions from the substrate. Suitable chemical groups (e.g. carboxyl) at the omega end of the adsorbed alkyl chains allow ...
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