| abstract |
The invention relates to a semiconductor device in which oxidation on the surfaces of connection electrodes can be prevented in order to improve the adhesive strength between the connection electrodes and external connections. The semiconductor device according to the invention includes connection electrodes for use in connecting external electrodes and a multilayer wiring structure connected to the connection electrodes, a surface of an insulation layer covering the connection electrodes and having the openings over the connection electrodes for exposing the surfaces of the connection electrodes is in contact with the metal layer formed of a material selected from noble metals and alloys containing these noble metals as main components. |