| abstract |
A process for the chemical metallization of substrates, in particular with electrically non-conductive surfaces, is proposed, with which the substrates can be metallized safely even under production conditions, which causes low costs and with which a selective coating exclusively of the substrates to be treated, but not of the surfaces the racks. The method comprises the following steps: DOLLAR A a. Pickling the surfaces with a solution containing chromium (VI) ions; DOLLAR A b. Activating the pickled surfaces with a silver colloid containing tin (II) ions; DOLLAR A c. Treating the activated surfaces with an accelerator solution containing fluoroborate ions to remove tin compounds from the surfaces; DOLLAR A d. Deposition of a layer consisting essentially of nickel on the surfaces treated with the accelerator solution with a chemical nickel deposition bath. |