Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76858 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
filingDate |
2000-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb9f0ac5b72c5c866c809ed9d704b2d7 |
publicationDate |
2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
DE-10041565-B4 |
titleOfInvention |
Metal interconnect, semiconductor device, method of forming a metal interconnect, and method of fabricating a semiconductor device |
abstract |
A metal interconnect buried in an insulating film and comprising: an adhesion layer containing zirconium and formed on the insulating film; a barrier layer formed on the adhesion layer; Copper-zirconium alloy islands formed separately between the adhesion layer and the barrier layer; and an interconnection material containing copper as a main component and formed on the barrier layer. |
priorityDate |
1999-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |