http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10021672-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6adec41d65a14c8a497143542aadcdf5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49007 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01D11-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-064 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01D11-24 |
| filingDate | 2000-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14e1780e3aafce21a316363715d47861 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7cfdb2cdddc73efe89f6b98cc3ea153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c2c933233fdb50f6b410fcf00915ce3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c41d966eecc4ec0b0570477407231ae1 |
| publicationDate | 2001-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-10021672-A1 |
| titleOfInvention | Hermetically encapsulated sensor and method for its manufacture |
| abstract | A sensor (20) has a housing (21) in which a thermosetting molding compound (22) is arranged, which is encapsulated by a thermoplastic molding compound (23) in a length range "D" in the longitudinal direction of the housing. The two molding compounds (22, 23) meet on a conical contact surface (24). An electrical connection element (27) is electrically connected to a circuit board (not shown) via lines (26). The circuit board is embedded in the two molding compounds (22, 23) at the center line A-A, the thermosetting molding compound (22) enclosing all electrically active components and conductor tracks of the circuit board. Ring grooves (28, 29) are arranged on the outside of the thermosetting molding compound (22). The thermoplastic molding compound (23) engages in these ring grooves (28, 29) in a positive and non-positive manner due to the extrusion coating. The groove arrangement (28, 29) has the advantage that an effective seal is ensured both when the temperature rises and when the temperature decreases, since either the one groove surface or the other groove surface due to the different material expansion of the two molding materials (22, 23 ) seal effectively. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10356880-B4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3474645-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10356880-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017127878-A1 |
| priorityDate | 2000-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635 |
Total number of triples: 23.