http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10003011-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ba923f6d4f7ba466f516490a1688288 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2000-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9efab99f0cc0961c2eb6f5927d9f3ac3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a51e4d61a3fdec812850cdaf61431de7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee38cf7919f2a11d8fbe98773d75e165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33ea8c3b88adbd4b8c6bbbf5a2d0607e |
| publicationDate | 2000-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-10003011-A1 |
| titleOfInvention | Photosensitive resin composition, printed circuit board, carrier material for the arrangement of semiconductor chips, semiconductor device and method for producing the printed circuit board, the carrier material for the arrangement of semiconductor chips and the semiconductor device |
| abstract | The present invention relates to a photosensitive resin composition comprising an oxygen sensitizer and a polyamic acid or a polyimide having substituents having a cis-diene structure as side chains; a printed circuit board, a carrier material for the arrangement of semiconductor chips and a semiconductor device produced by coating the carrier material with the composition and forming thin conductor images by irradiation; and a method for manufacturing a printed circuit board, a substrate for the arrangement of semiconductor chips and a semiconductor device, comprising: coating the substrate with the composition and formation of thin patterns by crosslinking the cis-diene group by polycondensation with oxidation with singlet oxygen , formed by the irradiation of the oxygen sensitizer in the presence of oxygen. DOLLAR A The negative type photosensitive resin composition shows high sensitivity, high resolution, can form a resin layer with excellent heat resistance, and can be used in the manufacture of semiconductor devices and printed circuit boards. The circuit boards, the substrate for the arrangement of semiconductor chips and the semiconductor device can be obtained using the composition. The methods provide the printed circuit boards, the carrier material for the arrangement of the semiconductor chips and the semiconductor device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017119280-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6900264-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03020638-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019038154-A1 |
| priorityDate | 1999-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 131.