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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f9ee1cd30c7b0c3ac824db992572eb7d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
filingDate 1988-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af138685e551b587858dfc31ff210e79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aeae93d6a5528fa34b0ddc30801c6ae4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b4b69d6847729d18d7a5cb2f46f97be
publicationDate 1989-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DD-270407-A1
titleOfInvention METHOD FOR SELECTIVELY APPLYING DILUTED METALS TO A III B V-COMPOUND OR COMPOUND SEMICONDUCTORS
abstract The invention relates to a method for selective plamachemic etching of thin noble metal or noble metal-containing layers on AIIIBV compound or Mischverbindungshalbleiteroberflaechen. By using a low ionic or radical energy to exploit desorption and sublimation enthalpy differences between noble metal and earth metal halides to reach the free AIIIBV compound or mixed compound semiconductor surface, it is possible, above all, to selectively remove gold-containing layers and structures such as those for micro-optoelectronics and AIIIBV microelectronics are required to generate.
priorityDate 1988-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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