http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DD-244768-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_76a1372806e7582f24c55558f9d30b23 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate | 1985-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a550b67a4ec58497e18eefd465cf0fc0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27462373fa58e5352807b6d4d9edd0b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83554e36baa4c1978adf94b21d0a7a3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c4c0758b647fb1b4859651e95296e7d |
| publicationDate | 1990-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DD-244768-B1 |
| titleOfInvention | PROCESS FOR MAINTAINING LOADING OF NICKEL LAYERS |
| abstract | The invention relates to a method for maintaining the solderability of nickel layers and is preferably used for the production of electronic components. The aim of the invention is to obtain the soldering capabilities of nickel-plated electronic components using an environmentally friendly gold plating process while conserving gold. According to the invention the object is achieved by the deposition of 10 to 50 nm thick, dense gold layers by the nickel-plated substrates for the period of 0.5 to 10 min in a known non-toxic, reductive gold bath with a pH in the range 7 to 13 and a temperature of 355 to 371 K at a bath load of 1 to 10 dm, / l are immersed. |
| priorityDate | 1985-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.