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filingDate 1981-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1983-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DD-200084-A1
titleOfInvention EPOXY RESIN COMPOSITIONS DEFINED REACTIVITY
abstract Defined reactivity epoxy resin compositions are used to make printed circuit board base materials in electronics / microelectronics.The compositions include medium molecular weight epoxy resins having an epoxy equivalent of 300 to 800 and a readily saponifiable chlorine content of 0.5 percent and 5 to 30 mass Percent of a combination of low molecular weight epoxides having an epoxide equivalent of 156 to 250 and an average molecular weight of 319 to 750 and low molecular weight chlorohydrin ethers having an average molecular weight of 380 to 920, wherein the content of easily saponifiable chlorine combination 0.05 to 7 , 5 mass percent.
priorityDate 1981-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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