| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_111052aebe489f2feb4b4a0967114a27 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2000-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f4b9d29ffc89b8c4345eff6dc0c6afb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f056c17beb87656378616ae968fe29 |
| publicationDate |
2009-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CZ-300550-B6 |
| titleOfInvention |
A method for producing a multilayer printed circuit board and a composite sheet for use in this process |
| abstract |
In producing a multilayer printed circuit board, the composite foil (10) containing the functional copper foil (16) attached to the carrier foil (12) is first laminated to the core sheet (20). A functional copper foil (16) having a thickness of less than 10 microns has a customs side facing the carrier film (12) and a back side covered with a resin coating (18). Thereafter, the carrier film (12) is removed from the functional copper foil (16) to expose the customs side of the functional copper foil (16). Then, using a CO 2 laser, the holes running through the functional copper foil (16) and the resin coating (18) are drilled to form a micro-hole. A composite film (10) comprising four different layers is intended for use in the manufacture of a multilayer printed circuit board. |
| priorityDate |
1999-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |