| abstract |
The invented epoxy resin mixtures for producing preforms and composite industrial materials providing refractory forming substances with high temperature of glass transition an at the same time exhibiting enhanced interlaminar adherence and adherence to copper, contain the following components: phosphorus-modified epoxy resin with epoxy value ranging from 0.02 to 1 mole/100 g built of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per one molecule and (B) at least one compound being selected from a group comprising phosphinic acids, phosphonic acids, pyrophosphonic acids and semiesters of phosphonic acids, - aromatic polyamine as a hardening ingredient. |