http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-217677829-U
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_71d7ce6ee061ee0c20686670f87d3804 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25C1-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25C7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate | 2021-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2022-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8b454ed24984e1e60f0d073138aaba5 |
publicationDate | 2022-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-217677829-U |
titleOfInvention | A system for removing glue residue and recycling |
abstract | The utility model discloses a glue-removing slag regeneration system, comprising: a frame, a regenerator, a fixing component and a top plate; a regeneration tank is arranged in the rack, the top plate is connected to the top of the rack, and the top plate is used for sealing the regeneration tank Cover; the fixing component includes a positioning copper flat and a conductive copper flat, one end of the positioning copper flat is connected to the top plate, the other end of the positioning copper flat extends into the regeneration tank, one end of the conductive copper flat is connected with the positioning copper flat, and the conductive copper flat The other end is connected with the inner wall of the frame; the regenerator is arranged in the regeneration tank, and the regenerator is connected with the conductive copper flat. The utility model fixes the conductive copper flats through the positioning copper flats extending into the regeneration tank, so that the conductive copper flats are stably arranged in the regeneration tank, which facilitates the subsequent installation of the regenerator on the conductive copper flats. The cover can effectively prevent the gas in the regeneration tank from overflowing, and avoid the formation of crystallization with the air, which will cause the copper flat surface to be easily oxidized and cause poor contact. |
priorityDate | 2021-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 194.