http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-216884683-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9de52bba13e16028dffa8775e3f3f28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e94a6560953c240ba70282f3763f4872 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2022-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffe408cfc955fabd22d77ce36119ac1e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78c83dba492a21ea8ab5c2cf174730b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f22f419418d26b22069b9cf5a6eb6d04 |
| publicationDate | 2022-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-216884683-U |
| titleOfInvention | Solid sand diamond wire silicon wafer cutting and electroplating integrated system |
| abstract | An integrated system for cutting and electroplating of silicon wafers with sand-fixing diamond wire comprises: a powder feeding and spraying mechanism, an electroplating mechanism and a cutting mechanism, wherein: the powder feeding and spraying mechanism is connected with the electroplating mechanism, and the cutting mechanism is arranged above the electroplating mechanism; the powder feeding and spraying mechanism It includes: a water pump, a filter, a plating solution and micropowder mixer and a liquid spray nozzle which are connected in sequence; the electroplating mechanism includes: a liquid storage tank and an anode plate and a liquid guide plate arranged in sequence; the cutting mechanism includes: respectively disposed in the electroplating The cutting wire wheel above both ends of the mechanism's reservoir and the cutting wire connected in between. The device can be used to cut a large silicon wafer with a width of 210 mm and a thin silicon wafer with a thickness of 150 microns to 90 microns, and reduce energy consumption. |
| priorityDate | 2022-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.