http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-216673467-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_296bca432c73ba2af55523ed7c250d2c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 |
| filingDate | 2021-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fde5a264313f0da2b7211018b204d2dc |
| publicationDate | 2022-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-216673467-U |
| titleOfInvention | A kind of fixing device of gold-tin soldering ring |
| abstract | The utility model provides a fixing device for a gold-tin soldering ring, which comprises a brazing die. The brazing die is provided with a sinking limit cavity for placing the gold-tin soldering ring, and the tin layer on the gold-tin soldering ring faces upwards. The cover plate is covered on the gold-tin welding ring, the pressure block is located on the cover plate, and the bottom of the pressure block is located in the limit cavity of the brazing mold. The utility model is suitable for gold-plated, nickel-plated palladium-gold, nickel-plated metal cover plates and metallized cover plates such as ceramics, glass, crystal, etc. The gold-tin soldering ring and the cover plate are fixed in surface contact, especially suitable for surface mount The cover plate of the narrow gold-tin solder ring for device packaging has high firmness and can withstand the use of tweezers, suction nozzles, etc. The gold-tin solder ring has good resistance to external impact. |
| priorityDate | 2021-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.