http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-216531954-U

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa4424ae7eaf24978d8c3198d9f75285
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04L25-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
filingDate 2021-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09cb5ee3f1d1ff03ea8f755b923c95bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f35d998f9d9672499dfe0550bd2556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d389eb3065e1a8b95587f67a3e1f5e0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99771b7b96d2bd6eb024b5628a2882e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5a3bf669f891ee43a2dfcf6a022ceea
publicationDate 2022-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-216531954-U
titleOfInvention An integrated ultra-miniature coupler
abstract The utility model belongs to the technical field of signal transmission elements, and particularly provides an integrated ultra-miniature coupler. The coupler mainly includes a protective cover, a bus, a sub-wire, a shell, and a circuit board assembly. The coupler uses chip resistors instead of metal film resistors, and by changing the position of the corresponding pads of the resistors, the overall layout of the circuit board components is optimized, and the circuit board manufacturing process is optimized to greatly reduce the length and height of the circuit board components; The sealing effect is achieved by filling the seam between the protective sleeve and the cable with sealant after heat shrinking, and the length of the protective sleeve is greatly shortened; the resistance of the components is improved by potting the gap between the inner wall of the shell and the circuit board assembly. Shock and vibration performance; improve the temperature resistance of components by assembling thermal insulation gaskets.
priorityDate 2021-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 23.