| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7b6c75a35909e52e6fc0c583c207237 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4691 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2020-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f39721f04768099c984ea3618e156d7d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b79247850bc442b63eec0b9cc5b7fa51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e46d5c6d5028695f14aae7e707cb9579 |
| publicationDate |
2022-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-216531888-U |
| titleOfInvention |
Resin multilayer substrate |
| abstract |
A resin multilayer substrate (101) comprising a base material (10A) formed by laminating a plurality of resin layers (11a, 12a) including an opening resin layer (resin layer (11a)), a conductor pattern (31), and layers Connect the conductors (V1, V2). A recessed portion (D11) is formed in the base material (10A). The opening resin layer (resin layer (11a)) is a resin layer disposed on the first principal surface (S1) side of the other resin layers (12a). The concave portion ( D11 ) is composed of a first opening ( AP11 ) formed by cutting from the side of one surface ( VS1 ) of the opening resin layer, and another resin layer ( 12 a ). The interlayer connection conductors (V1, V2) are formed by the second opening filled conductors formed by cutting from the other surface (VS2) side of the opening resin layer. The edge part on the side of one surface (VS1) of the first opening (AP11) is not in contact with the conductor pattern (31). |
| priorityDate |
2019-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |