http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-215934827-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62c472237990b0d1e6c583395a0bec20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-10 |
| filingDate | 2021-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab7123f3922f5422c6da0d0774dc4fa6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a3b4e21517c513a25fbf98efaea59d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d6742de4f868423e9550bfc6b6cab9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4af4077b3d0bf97f572a4c7a1779eaa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ee71d56c9267370fbd88ff7be0a5bc2 |
| publicationDate | 2022-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-215934827-U |
| titleOfInvention | Packaging structure of acoustic wave device |
| abstract | The utility model discloses a packaging structure of an acoustic wave device, which relates to the field of semiconductor packaging and comprises a carrier plate, an acoustic wave device and epoxy resin; a bonding pad and a solder mask layer are formed on the first surface of the carrier plate, and at least one bonding pad is exposed out of the solder mask layer; the first surface of the substrate of the acoustic wave device is provided with electrodes, and at least one electrode is connected with a bonding pad exposed out of the solder mask layer, so that the acoustic wave device is inversely arranged on the first surface of the carrier plate; the solder mask layer at least covers the orthographic projection area of the acoustic wave device on the first surface of the carrier plate, and a gap is formed between the solder mask layer and the first surface of the acoustic wave device substrate; the epoxy resin is formed on the first surface of the carrier plate, wraps the acoustic wave device and seals the gap to form a cavity structure. This application has reduced the cavity size between acoustic wave device substrate and the carrier plate through the solder mask for gaseous inflation diminishes, the internal pressure change is less in the cavity, is not enough to damage acoustic wave device major structure, and the device performance can be guaranteed. |
| priorityDate | 2021-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419520408 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID82850 |
Total number of triples: 19.