http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-215592976-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad7024c0322ee3cb39b0a8424fcd7327 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20 |
| filingDate | 2021-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e4286bb8168f8d808edf261a6eab3e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a16e4a7856e6c954d28430428ee8a9e3 |
| publicationDate | 2022-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-215592976-U |
| titleOfInvention | Assembled gasket and electronic assembly |
| abstract | The assembled gasket comprises a double-sided tape, a single-sided tape, a first substrate and a second substrate, wherein the single-sided tape is located in a first hollowed-out area of the double-sided tape, the double-sided tape is adhered to the upper portion of the first substrate, a second hollowed-out area of the first substrate is located in the first hollowed-out area of the double-sided tape, the second substrate is adhered to the lower portion of the first substrate, and at least part of the back surface of the single-sided tape penetrates through the second hollowed-out area of the first substrate and is adhered to the top surface of the second substrate. When two electronic elements need to be pasted, one of the electronic elements is pasted with the top surface of the double-sided tape and the top surface of the single-sided tape in the assembly gasket at the same time, and then the second substrate and the first substrate are sequentially torn off, and then the other electronic element is pasted. The assembling gasket can enable the double-sided adhesive tape and the single-sided adhesive tape to be synchronously attached to the electronic element, so that the attaching process is reduced, and the assembling precision is improved. |
| priorityDate | 2021-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419484328 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6318 |
Total number of triples: 15.