http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-215119537-U

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b64c99d91157563abb6d7d08cee9041c
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-18305
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-0234
filingDate 2021-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0381a4adee3941c01572e0e4472ecbbd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6d0050b56712cca19c8b2e35c2ab783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e13ea7ce75646e449d132db878abc06b
publicationDate 2021-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-215119537-U
titleOfInvention Vertical cavity surface emitting laser having flip-chip structure, and vertical cavity surface emitting laser array
abstract The utility model provides a vertical cavity surface emitting laser, vertical cavity surface emitting laser array that possess flip-chip structure, VCCEL include the substrate, set up in first mirror layer on the substrate, set up in active layer on the first mirror layer with set up in second mirror layer on the active layer, set up the molybdenum metal layer on the second mirror layer, the second mirror layer with be provided with electrode layer on between the molybdenum metal layer, the substrate with be provided with the etching stop layer between the first mirror layer, the etching stop layer material is different from the substrate material, the substrate sets up the optical window and is used for light to jet out, just the non-optical window region of substrate sets up the bottom electrode. The array of vcsels includes at least 2 vcsels. The utility model discloses metal heat dissipation layer preparation is simple, and suitable preparation high power array VCCEE L chip.
priorityDate 2020-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419405613

Total number of triples: 24.