http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-215008218-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0c3b9e2dea4f92192cf950c0c598f36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate | 2021-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b303e8735799ba2aea141b4f50288bfb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65a3b4d09712cbe93228a77cc60190b5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f8733b7d94b700a0ba34709be24852d |
| publicationDate | 2021-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-215008218-U |
| titleOfInvention | Substrate and memory device including the same |
| abstract | The utility model relates to a substrate, include: a core layer formed of a dielectric material; a conductive pattern formed on the first surface of the core layer, a plating process line of the conductive pattern including at least one conductive pattern opening, at least a portion of at least one signal line of the conductive pattern being electrically disconnected from the plating process line at the at least one conductive pattern opening; a solder mask covering the conductive pattern, the solder mask including an electrical contact opening exposing the electrical contact portion and at least one solder mask opening exposing the at least one conductive pattern opening of the plating process line such that the core layer and the conductive pattern are not covered by the solder mask at the at least one solder mask opening; and at least one curable filling part formed of a curable material filling the at least one solder resist mask opening and the at least one conductive pattern opening. The present invention also relates to a semiconductor device including the above substrate. |
| priorityDate | 2021-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10935 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558839 |
Total number of triples: 15.