http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-214955005-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7485c44abd5f0bfd2e9504705f517f81 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K9-00 |
| filingDate | 2021-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5163fb26d03ed0175f410958983236c6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c8fc84842f8c104ab71510d7f0bf492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d50e40a954fffb4530dc49ae68db5e8c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e85b3613ddaf3f2c41545401c63629f4 |
| publicationDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-214955005-U |
| titleOfInvention | But fingerprint module under ultra-thin optical screen of SMT |
| abstract | The utility model discloses an ultra-thin optical screen lower fingerprint module capable of SMT, which comprises a lens and a fingerprint chip; the lens is arranged on the fingerprint chip; the lens is a wafer-level optical lens, and the upper surface of the lens is provided with a plurality of micro lenses; fingerprint chip adopts CSP packaging structure, and fingerprint chip bottom is provided with the pin, and the pin is used for connecting terminal equipment's mainboard, and fingerprint chip carries out the electricity through pin and terminal equipment's mainboard and is connected. A plurality of microlens arrays are arranged on the upper surface of the lens. Adopt CSP packaging structure's fingerprint chip, laminate camera lens and fingerprint chip, adopt SMT technology and terminal equipment's mainboard to carry out the electricity with the pin of fingerprint chip bottom and connect formation fingerprint module under the ultra-thin optical screen. Simple structure effectively reduces the height of fingerprint module, provides an implementation for promoting standardized fingerprint module, very big reduction design and manufacturing cost. |
| priorityDate | 2021-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.