http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-214276066-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_366759959a879950036c4e69dc8fd483 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28D20-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28F21-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F24F13-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F24F8-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F25B21-02 |
| filingDate | 2021-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb3f8433d410f6875f2190097721954c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6537ef3775a701998e05da0ebbf362c2 |
| publicationDate | 2021-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-214276066-U |
| titleOfInvention | Remove formaldehyde device |
| abstract | The utility model relates to the technical field of formaldehyde absorption, and discloses a formaldehyde removing device, which comprises a shell, a heat absorption energy storage mechanism, a heat conduction silica gel pad, a semiconductor refrigeration sheet and a formaldehyde adsorption mechanism; an air inlet is formed in one side of the shell, a fan is arranged at the position of the air inlet, an air outlet is formed in the other side of the shell, the formaldehyde adsorption mechanism is installed in the shell close to the air outlet, and the heat absorption and energy storage mechanism is installed in the shell close to the air inlet; the semiconductor refrigeration piece is embedded in the shell, one side surface of the semiconductor refrigeration piece, which is positioned in the shell, is contacted with the formaldehyde adsorption mechanism, and the other side surface of the semiconductor refrigeration piece is sealed by a heat-conducting silica gel pad. Compared with the prior art, the utility model discloses set up heat absorption energy storage mechanism and semiconductor refrigeration piece, semiconductor refrigeration piece cold junction is used for reducing gas temperature, reduces the gas temperature of formaldehyde adsorption mechanism of flowing through, maintains formaldehyde adsorption mechanism at lower temperature, and the hot junction is to the environment heat dissipation, improves ambient temperature, the formaldehyde release in the decoration material with higher speed. |
| priorityDate | 2021-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.