http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-213522815-U

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1c3f3052fdfc906865a42a4869b4967f
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
filingDate 2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b39ae0268dc444cf4ea9b8a2a461a45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4de8bb45bdec749b1c631ba4e4bbbeee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ed741167db2ca98830e6dbaeb28d552
publicationDate 2021-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-213522815-U
titleOfInvention High-efficiency heat dissipation closed case based on phase change heat dissipation technology
abstract The utility model discloses a high-efficient heat dissipation airtight machine case based on phase transition heat dissipation technique, mainly include heat pipe heat abstractor etc. the left side board of machine case left and right sides for being provided with U type guide rail slot respectively, the right side board, quick-witted case rear side installation back shroud, the work module contact soaking plate cold drawing surface of function integrated circuit board, the samming board cold drawing of installing the function integrated circuit board inserts the left side board, the U type guide rail slot of right side board and the locking device contact by samming board cold drawing both sides upper surface, heat pipe heat abstractor's evaporation zone and the upper surface contact of samming board cold drawing. The soaking plate cold plate of the utility model conducts the heat of the functional board card to the left and right side plates of the closed case; the heat pipe radiating device effectively adjusts the heating area of the condensation section and utilizes the radiating fins of the rear cover plate of the case to radiate heat efficiently; the phase-change heat dissipation technology is utilized, so that the electromagnetic interference resistance and the noise value are greatly reduced, the heat dissipation performance is excellent, and the heat dissipation requirements of a high-power board card and a high-heat-power-density closed case are met.
priorityDate 2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

Total number of triples: 18.