http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-213305482-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e41e5d2c311d5091b9383a1778180613 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04M1-18 |
| filingDate | 2020-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79a22950f3e955d508133ada5ddd9a7a |
| publicationDate | 2021-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-213305482-U |
| titleOfInvention | Novel graphene temperature control heat dissipation mobile phone shell |
| abstract | The utility model discloses a novel graphene temperature control heat dissipation mobile phone shell, which comprises a mobile phone shell main body, wherein the interior of the mobile phone shell main body adopts a hollow structure, the interior of the mobile phone shell body consists of an upper surface of a plastic layer, a hollow layer, a heat dissipation layer and a lower surface of the plastic layer, the upper surface of the plastic layer is positioned on the upper surface of the hollow layer, the lower surface of the plastic layer is positioned on the lower surface of the hollow layer, a liquid inlet slotted hole is formed in the surface of the mobile phone shell main body, a sealing cover is arranged on the outer surface of the liquid inlet slotted hole, the adjusted heat dissipation material is injected into the hollow layer in the mobile phone shell through the glue injection machine to form the heat dissipation layer, and finally the heat dissipation layer is sealed, the heat dissipation material is conducted to the back of the whole mobile phone to be uniformly dispersed, so that the heat dissipation area is enlarged, the temperature of a chip is reduced, the heat dissipation material is maintained in the mobile phone shell, a large amount of heat energy can be well absorbed, and the normal operation of the mobile phone is maintained constantly. |
| priorityDate | 2020-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581 |
Total number of triples: 15.