http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-212991121-U
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_689a6d763f3a49574e5d7c328998c02c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86dfb0d0819e3f88ea788643500dc88c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_45be39ab35d86e0256faa9a3c2ce97c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3eb9fa526ecb67d9f96db22bae3c2b9 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
filingDate | 2020-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_209ce436920decc3122c8a71ebe966da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67f38bf79eab8446df10ecce0c0aa6d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a21dfe542e064cac860649f18402922 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75f68224b10b446ad24446c269f3294c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_125098ce8e6b7a497dbb80b06d978ca4 |
publicationDate | 2021-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-212991121-U |
titleOfInvention | LED insulation heat radiation structure and light emitting device |
abstract | The utility model provides a LED insulation heat radiation structure and illuminator. The LED insulation heat dissipation structure comprises a conductive circuit; an LED chip electrically connected with the conducting circuit is arranged above the conducting circuit; an insulating layer is arranged below the conducting circuit; a radiator which is jointed and connected with the insulating layer is arranged below the insulating layer; the insulating layer includes a ceramic insulating layer such as an alumina insulating layer or an aluminum nitride insulating layer. The LED light-emitting device comprises the LED insulating heat dissipation structure and an outer cover. The utility model has simple structure, easy operation and low cost; the insulating layer has higher insulating and voltage-resisting performance and good heat conduction performance; the insulating layer with good heat conductivity is connected with the radiator, so that the radiating efficiency of the structure is improved, and the service life of the structure is prolonged; the LED chip with the vertical structure reduces the thickness of the structure, and the heat dissipation of the LED chip can be accelerated by the cooperation of the LED chip and the insulating layer, so that the LED chip is particularly suitable for high-power LED light-emitting devices. |
priorityDate | 2020-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.