http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-212910443-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d36403418c8a7334d0e158ab96cda392 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02 |
| filingDate | 2020-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86ec2f57795454ec9af0c1f5dc711999 |
| publicationDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-212910443-U |
| titleOfInvention | Three-channel high-power gold plating box |
| abstract | The utility model discloses a three-channel high-power gold-plating box, which comprises a structure main body, wherein the structure main body comprises a gold-plating packaging box and a gold-plating packaging box cover hermetically connected with the gold-plating packaging box; the gold-plated packaging box is provided with a plurality of groups of electronic component mounting cavities, and a plurality of groups of optical fiber channels corresponding to the electronic component mounting cavities are arranged on two sides of the gold-plated packaging box; the three-channel high-power gold-plating box is made of TUO oxygen-free copper material, and the surface is provided with the nickel-plating layer and the gold-plating layer to form an airtight cavity structure, thereby achieving the purposes of no bubbling, no deformation and high signaling function; the three-channel high-power gold-plating box is characterized in that the bare chip with the airtight cavity structure and the circuit substrate are arranged and erected in the gold-plating packaging box through a post-packaging process, and the three-channel high-power gold-plating box plays roles in mechanical support, airtight protection and internal and external circuit protection. |
| priorityDate | 2020-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.