| abstract |
The present application relates to sensor devices. In one example, an apparatus is disclosed that includes a substrate, a sensor on the substrate including an active surface and sensor bond pads, a mold layer on the substrate and overlying sides of the sensor, the mold layer relative to The molding height of the top surface of the substrate is greater than the height of the active surface of the sensor relative to the top surface of the substrate, as well as the capping layer on the molding layer and the active surface. The capping layer and the molding layer form a space on the active surface of the sensor that defines the flow channel. |