| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-142 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate |
2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56b317c832e5bf9fe29064df8e679410
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0f72b50af9a3e6bf7a8d3059eaf7748
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffbe6c81c341ecb1462bcd8450da79cf |
| publicationDate |
2021-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-212463677-U |
| titleOfInvention |
Multilayer wiring board and electronic equipment |
| abstract |
The utility model provides a multilayer wiring substrate and an electronic device. The multilayer wiring board of the present invention is characterized by comprising a first insulating layer, a second insulating layer laminated on the first insulating layer, and a filter provided inside each of the first insulating layer and the second insulating layer. A hole conductor and a conductive bonding layer for bonding the via-hole conductors to each other, the first insulating layer and the second insulating layer are directly bonded, and the maximum diameter of the bonding layer is a 1 , and the bonding is When the maximum diameter of the via-hole conductor at the interface of the layers is set to b 1 , the relationship of a 1 >b 1 is established, and the metal content in the via-hole conductor is 99 wt % or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023124883-A1 |
| priorityDate |
2017-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |