http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-212344315-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62c10ff70fa3b0c84a3e2bbfa15cdca9 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-027 |
| filingDate | 2020-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9e05566639b2bb50742bb793e02577e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32f38b4efee3bef20ba70fde8c38e746 |
| publicationDate | 2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-212344315-U |
| titleOfInvention | Double-layer structure type heat-conducting gasket |
| abstract | The utility model discloses a double-layer structure type heat conduction gasket, including first heat conduction silica gel layer and second super soft heat conduction silica gel layer, first heat conduction silica gel layer and second super soft heat conduction silica gel layer calendering connection, first heat conduction silica gel layer is kept away from second super soft heat conduction silica gel layer one side and is provided with first from the type layer, second super soft heat conduction silica gel layer is kept away from first heat conduction silica gel layer one side and is provided with second from the type layer, the utility model discloses applied first layer, calendering thickness 0.1mm ~ 0.3mm heat conduction silica gel, shoe00 hardness 60 ~ 80, intensity is high, has certain toughness; the second layer is rolled to the thickness of 0.5-15 mm, the hardness of shoe00 is 5-30, the wettability is good, the compression performance is large, and the first layer of heat-conducting silicon is compounded together, so that the whole heat-conducting coefficient of the gasket is 1.5-5.0W, a certain supporting and shaping effect is achieved, the heat-conducting effect is good, the adhesion performance is good, the interface thermal resistance is small, and the gap filling capacity is strong. Compared with the original glass fiber cloth base material or PI base material, the heat conduction effect is greatly improved. |
| priorityDate | 2020-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261 |
Total number of triples: 20.