http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-211792701-U

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6980f17662d4618fdb43a30efd22c072
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
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filingDate 2020-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d58b528595a18103f63047f09bb3859e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a13394b4593a83ce326f765b1fa9e3b
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publicationDate 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-211792701-U
titleOfInvention EMC shielding structure with heat dissipation function
abstract An EMC shielding structure with a heat dissipation function comprises a shielding case and a PCBA circuit board; the shielding cover is fixed on the PCBA circuit board, and a chip is arranged on the PCBA circuit board; the shielding cover is made of a heat-conducting metal material and comprises a shielding cover body and a heat dissipation frame; the heat dissipation frame is connected with the shielding case body and comprises a bottom plate and heat dissipation convex pieces arranged on the periphery of the bottom plate respectively, the bottom of each heat dissipation convex piece is connected with the bottom plate, and a gap is formed between every two adjacent heat dissipation convex pieces; the top surface of the chip is provided with heat conducting glue which is in contact with the shielding case. The utility model discloses simple structure has had heat dissipation function and electromagnetic field resistant mutual interference function concurrently simultaneously to be favorable to the electronic product miniaturization.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113879230-A
priorityDate 2020-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.