http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-211509708-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-29 |
| filingDate | 2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ba2d168e27b562b5bb66336bda811ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d93bb593dd0c481779a32e454b555ef |
| publicationDate | 2020-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-211509708-U |
| titleOfInvention | Electromagnetic wave shielding film and printed wiring board with electromagnetic wave shielding film |
| abstract | The utility model provides an electromagnetic wave shielding film, even the pressure when taking the printed wiring board of insulating film and electromagnetic wave shielding film crimping is low, also can bond the anisotropic conductive adhesive layer of electromagnetic wave shielding film and the printed circuit of printed wiring board reliably through the perforating hole of insulating film to can be connected the metal thin layer of electromagnetic wave shielding film and printed circuit electricity reliably. The electromagnetic wave shielding film 1 has, in order: the insulating resin layer 10, the metal thin film layer 22, and the anisotropic conductive adhesive layer 24 containing the thermosetting adhesive 24a and the conductive particles 24B, wherein the thickness A of the thermosetting adhesive 24a of the anisotropic conductive adhesive layer 24 and the average particle diameter B of the conductive particles 24B satisfy the relationship of 1.1A. ltoreq. B.ltoreq.3.0A, and the thickness A of the thermosetting adhesive 24a is 3 [ mu ] m or more. The utility model also provides a take electromagnetic wave shielding film's printed circuit board. |
| priorityDate | 2018-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.