http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-211376614-U

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e41757d7a0160f0813cc7ceab7a2659
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48
filingDate 2019-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca9fa226975f6c41c86aa484c7c8a667
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62f68ba5bba56eceabf17152ec3e71c3
publicationDate 2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-211376614-U
titleOfInvention Carrier for chip packaging
abstract The utility model relates to a carrier for chip packaging, which comprises a carrier plate, a pyrolytic film and a double-sided film; the pyrolytic film is pasted on the carrier plate, the double-sided film is pasted on the pyrolytic film, and the pyrolytic film is used for pasting the matrix array of the chips; the film surface of the pyrolysis film, which is adhered to the support plate, has viscosity, the viscosity disappears after heating, and the double surfaces of the double-sided film have viscosity. The carrier can be used for pasting a matrix array of chips and provides support for the uniform packaging of the chips arranged in a matrix.
priorityDate 2019-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 22.