http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-211376614-U
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e41757d7a0160f0813cc7ceab7a2659 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
filingDate | 2019-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca9fa226975f6c41c86aa484c7c8a667 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62f68ba5bba56eceabf17152ec3e71c3 |
publicationDate | 2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-211376614-U |
titleOfInvention | Carrier for chip packaging |
abstract | The utility model relates to a carrier for chip packaging, which comprises a carrier plate, a pyrolytic film and a double-sided film; the pyrolytic film is pasted on the carrier plate, the double-sided film is pasted on the pyrolytic film, and the pyrolytic film is used for pasting the matrix array of the chips; the film surface of the pyrolysis film, which is adhered to the support plate, has viscosity, the viscosity disappears after heating, and the double surfaces of the double-sided film have viscosity. The carrier can be used for pasting a matrix array of chips and provides support for the uniform packaging of the chips arranged in a matrix. |
priorityDate | 2019-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.