http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-211150798-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f12daffdb0ceed1be214c80c9a5c99b5 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B5-053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01G21-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01G19-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-50 |
| filingDate | 2019-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9cb3720fc1669f3edfc5514d38bb1e4 |
| publicationDate | 2020-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-211150798-U |
| titleOfInvention | Copper foil connecting structure for electronic scale |
| abstract | The utility model discloses a copper foil connection structure for electronic scale, its characterized in that: comprises ITO glass, copper foil and a connecting assembly; a copper foil electrically connected with the PCBA bonding wire; and the connecting assembly is used for bonding the copper foil on the ITO glass and keeping a bonding state. The utility model has simple structure, adopts the copper foil conductive technology, and leads the copper foil to be electrically connected with the PCBA welding wire by laminating the copper foil on the ITO film of the ITO glass, the ITO film is contacted with the copper foil to lead a current signal into a human body through the ITO film, and simultaneously, an induced voltage signal is obtained through the ITO film, and the impedance of the human body is measured; the copper foil is in a sheet shape, so that the contact area of the copper foil and the ITO film is increased, the contact impedance is reduced, the size of the decorative cover is correspondingly reduced while the human body impedance measured by the product is more accurate, and the production cost is reduced; the copper foil conductive technology is applied to facilitate the assembly process of the product. |
| priorityDate | 2019-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6318 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419484328 |
Total number of triples: 19.