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filingDate 2019-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-210885603-U
titleOfInvention Chemical copper plating wastewater treatment device
abstract The utility model relates to a waste water treatment equipment field discloses a chemistry copper facing effluent treatment plant, subside subassembly, oxidation subassembly and second grade including broken twine subassembly, one-level. The first-level sedimentation component comprises a first pH adjusting tank and a first sedimentation tank, the oxidation component comprises a second pH adjusting tank and an oxidation tank, the second-level sedimentation component comprises a second coagulation tank, a second flocculation tank and a second sedimentation tank, the first pH adjusting tank, the first sedimentation tank, the second pH adjusting tank, the oxidation tank, the second coagulation tank, the second sedimentation tank and the second sedimentation tank are sequentially communicated. This device has the settlement effect better, can not cause secondary pollution and can reduce the advantage of COD content, colourity and smell.
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