http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-210535433-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fc9cb8468ccde12ea5d48a5177990c2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-12 |
| filingDate | 2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13e0df9e6be72fffb08fe825a103e0d2 |
| publicationDate | 2020-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-210535433-U |
| titleOfInvention | Industrial frequency arc extinguishing resistant packaged piezoresistor |
| abstract | A power frequency arc extinguishing resistant packaged piezoresistor is characterized in that a pressure-sensitive chip is packaged by mixing insulating plastic and an arc-proof material outside the pressure-sensitive chip; or the pressure-sensitive chip is firstly encapsulated with the insulating applying layer and then encapsulated with the insulating plastic and arc-proof mixed material; or a sand-fixing protective layer is coated outside the packaging box after the packaging is finished. The arc-proof material is preferably quartz sand or silanized quartz, and the insulating material is preferably epoxy resin, silicone resin or silicon rubber. By fixing the quartz sand position and utilizing the characteristic that the softening temperature of the quartz sand is lower than the melting point of the zinc oxide pressure-sensitive device, the SiO2 which is firstly melted in the deterioration process of the pressure-sensitive chip can repair the pressure-sensitive device and block the deterioration process of the pressure-sensitive device. The power frequency tolerance, the arc resistance and the surge impact resistance of the pressure sensitive device packaged by the technology are greatly improved, and the manufacturing cost is reduced to a certain extent. |
| priorityDate | 2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.